AIZ
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One enclosure. Two variants.
Designed for most industrial and commercial environments.

Each AIZ node is a self-contained modular enclosure measuring 5.4 × 1.1 × 2m — housing one full-height 42U server rack inside an engineered shell with precision airflow channels, thermal insulation, and acoustic dampening. HVDC or solar PV power, fibre network — all at the panel. Designed for harsh and demanding environments.

Form Factor
¼ × 40ft
ISO shipping container footprint
Dimensions
5.4 × 1.1 × 2m
L × W × H, shell exterior
Power Input
HVDC / PV
HVDC and solar PV inputs at panel
Deployment
Plug-and-play
External interfaces only — weeks not months

One rack. One shell. All interfaces at the panel.

TOP VIEW — AIZ ENCLOSURE · 5.4 × 1.1 × 2m POWER DC HVDC PV NETWORK 400G IB 100G ETH 10G RJ45 COOL AIR IN 42U SERVER RACK FULL HEIGHT HOT AIR OUT POWER DC HVDC PV NETWORK 5.4m
1 × 42U Rack
Full-height server rack
HVDC · PV Input
HVDC and solar PV at panel
Network at Panel
400G IB · 100G ETH · 10G RJ45
Precision Airflow
Channelled front-to-back
Thermal Insulation
Engineered shell lining
All-Weather Rated
Engineered for harsh environments
In Production

AIZ Air Node

The AIZ Air Node delivers precision airflow cooling tuned for NVIDIA Hopper and Ampere GPU architectures. A PID-controlled fan array maintains optimal hot-aisle cold-aisle separation within the enclosure — enabling sustained GPU workloads without thermal throttling, at a PUE well below conventional data centre installations.

GPU Compatibility
GPU Memory Interface TDP
A100 40GB / 80GB SXM4 ~400W
H100 80GB SXM5 ~700W
H200 141GB SXM5 (air) ~700W
L40S 48GB PCIe ~350W
A800 80GB SXM4 ~300W
Cooling
Precision airflow
Fan control
PID closed-loop
Redundancy
N+1 fan array
Insulation
Thermal + acoustic
Noise
Dampened shell
Status
In production
Air Node PUE
<1.14
Power Usage Effectiveness
validated against ASHRAE
thermal guidelines
R&D

AIZ Thermal Node

The AIZ Thermal Node uses a dielectric liquid cooling loop to handle the extreme thermal density of next-generation GPU accelerators. Integrated heat reuse captures and redistributes thermal output for practical secondary use cases, including vertical agriculture support. This approach targets a PUE below 1.08 and helps reduce overall carbon footprint for high-density AI workloads at the edge.

GPU Compatibility
GPU Memory Interface TDP
H200 141GB SXM5 (liquid) ~700W
B200 192GB SXM6 ~1000W R&D

H200 (SXM5) straddles air and liquid variants — the air-cooled variant ships first; liquid thermal loop validation is ongoing for sustained high-density configurations.

Cooling
Dielectric liquid
Heat reuse
Integrated loop + agritech support
Insulation
Thermal + acoustic
Noise
Dampened shell
Form factor
Same enclosure
Status
R&D
Thermal Node PUE
<1.08
Power Usage Effectiveness
derived from measured
thermal modelling

Our PUE targets were established through measured thermal modelling, then validated using a controlled thermal test rig simulating sustained GPU thermal load before any production hardware was committed. This is the level of rigour applied to every design decision.

Review the engineering background